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EXHIBITION
CAR-ELE JAPAN−4th Int'l Automotive Electronics Technology Expo
DATE Date: From 18 to 20 Jan. 2012
Venue Venue: Tokyo Big Sight
Products Products: Semi-auto Large Wire Bonder/ Ultrasonic Bonding Unit
Remarks Remarks: Please check the web link for our exhibition detail
NEPCON JAPAN 2012
DATE Date: From 18 to 20 Jan. 2012
Venue Venue: Tokyo Big Sight
Products Products: Rework station/Solder ball mounter/Reflow oven
Remarks Remarks: Please check the web link for our exhibition detail
SEMICON JAPAN 2011
DATE Date: 7 - 9 December 2011 10:00-17:00
Venue Venue: Makuhari Messe
Products Products: New heavy wire bonder SHB-150 and others
Remarks Remarks: For more details please check SEMICON Japan website
Our products and booth info.
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