PRODUCTS -Shinapex-

PRODUCTS

	Large Wire Bonder SHB-150 for Manual/Semi-Automatic bonding SHB-150 is a manual/semiautomatic wedge bonder for large diameter bonding wire and ribbon wire. The compact table -top unit is ideal for laboratory, prototyping and small scale production.
	Ultrasonic Bonding Unit SWB-105, SWB-150 The standard system is ideal for ultrasonic micro joining experiments using various minute metal materials for microelectronics applications. The bonding head assembly is also applicable for automation system.
	Single solder ball placement system STM-203FB Ball placement for 0.2mm - 0.75mm dia. solder ball. Easy programmable ball matrix pattern with touch panel.
	Precision Reballing unit SMU-50 for BGA and CSP SMU-50 is suitable for prototyping and reballing of ball grid allay components such as BGA, CSP.
	Micro Rework Station SMR-402 (New Product 2010) Compact Table-top Micro Rework Station SMR-402 is a manual rework station specially designed for rework of surface mount micro chip components such as 0402mm(01005inch) size chip register and chip capacitor.
	Table-top Conveyer Reflow Oven SCR-4500 Compact Table-top Conveyer Reflow Oven with unique IR heating for uniform area heating, suitable for low to mid volume production.
	Table-top Batch Reflow Oven STR-3000RC/3100RC Small footprint Batch reflow oven with unique temperature feed back control feature. Available for reflow soldering and heating test.